SBOS124C January   2000  – January 2026 XTR115 , XTR116

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reverse-Voltage Protection
      2. 7.3.2 Overvoltage Surge Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Transistor
      2. 8.1.2 Minimum Scale Current
      3. 8.1.3 Offsetting the Input
      4. 8.1.4 Maximum Output Current
      5. 8.1.5 Radio Frequency Interference
      6. 8.1.6 Circuit Stability
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.1.2 Minimum Scale Current

The quiescent current of the XTR11x (typically 200μA) is the lower limit of the device output current. Zero input current (IIN = 0A) produces an IO equal to the quiescent current. Output current does not begin to increase until IIN > IQ / 100. Current drawn from VREF or VREG adds to this minimum output current. This means that more than 3.7mA is available to power external circuitry while still allowing the output current to go below 4mA.