SBOS293J December   2003  – March 2025 OPA695

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics VS = ±5 V, OPA695ID, OPA695IDBV, OPA695DSG
    6. 5.6  Electrical Characteristics VS = 5 V, OPA695ID, OPA695IDBV, OPA695DSG
    7. 5.7  Electrical Characteristics VS = ±5 V, OPA695IDGK
    8. 5.8  Electrical Characteristics VS = 5 V, OPA695IDGK
    9. 5.9  Typical Characteristics: VS = ±5 V, OPA695IDBV, OPA695ID, OPA695DSG
    10. 5.10 Typical Characteristics: VS = 5 V, OPA695IDBV, OPA695ID, OPA695DSG
    11. 5.11 Typical Characteristics: VS = ±5 V, OPA695IDGK
    12. 5.12 Typical Characteristics: VS = 5 V, OPA695IDGK
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Wideband Current-Feedback Operation
      2. 6.3.2 Input and ESD Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Suggestions
        1. 7.1.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 7.1.1.2 Output Current and Voltage
        3. 7.1.1.3 Driving Capacitive Loads
        4. 7.1.1.4 Distortion Performance
        5. 7.1.1.5 Noise Performance
        6. 7.1.1.6 Thermal Analysis
      2. 7.1.2 LO Buffer Amplifier
      3. 7.1.3 Wideband Cable Driving Applications
        1. 7.1.3.1 Cable Modem Return Path Driver
        2. 7.1.3.2 Arbitrary Waveform Driver
      4. 7.1.4 Differential I/O Applications
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Saw Filter Buffer
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Design-In Tools
        1. 8.1.1.1 Demonstration Fixtures
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) OPA695 UNIT
D (SOIC) DBV (SOT-23) DGK (VSSOP) DSG (WSON)
8 PINS 6 PINS 6 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 136 164 135 86.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78 80 81 109 °C/W
RθJB Junction-to-board thermal resistance 85 49 56 52.9 °C/W
ΨJT Junction-to-top characterization parameter 24 28 8.5 8.3 °C/W
ΨJB Junction-to-board characterization parameter 84 49 48 52.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 27.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.