SBOS550C February   2011  – May 2026 TXS4555

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Thermal Information
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Electrical Characteristics – Level Translator
    6. 4.6  LDO Electrical Characteristics
    7. 4.7  General Electrical Characteristics
    8. 4.8  Switching Characteristics
    9. 4.9  Operating Characteristics
    10. 4.10 Typical Characteristics
  6. 5Detailed Description
    1. 5.1 Functional Block Diagram
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Input And Output Capacitor Requirements
      2. 6.1.2 Output Noise
      3. 6.1.3 Internal Current Limit
      4. 6.1.4 Dropout Voltage
      5. 6.1.5 Startup
      6. 6.1.6 Transient Response
      7. 6.1.7 Minimum Load
      8. 6.1.8 Thermal Information
        1. 6.1.8.1 Thermal Protection
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Thermal Protection

Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is then enabled again. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, and protects the regulator from damage because of overheating.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, maximum junction temperature must be limited to 125°C. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection must trigger at least 35°C above the maximum expected ambient condition of your particular application. This configuration produces a worst-case junction temperature of 125°C, at the highest expected ambient temperature and worst-case load.

The internal protection circuitry of the TXS4555 is designed to protect against overload conditions. It is not intended to replace proper heat sinking. Continuously running the TXS4555 into thermal shutdown degrades device reliability.