SBOSAG5B December   2024  – December 2025 TLV2888 , TLV888

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: TLV888
    5. 5.5 Thermal Information: TLV2888
    6. 5.6 Thermal Information: TLV4888
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Common-Mode Range
      2. 6.3.2 Phase-Reversal Protection
      3. 6.3.3 Chopping Transients
      4. 6.3.4 EMI Rejection
      5. 6.3.5 Electrical Overstress
      6. 6.3.6 MUX-Friendly Inputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Noise Calculations
    2. 7.2 Typical Applications
      1. 7.2.1 High-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Programmable Current Source
      3. 7.2.3 Programmable Current Source For A Grounded Load
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision A (September 2025) to Revision B (December 2025)

  • Changed TLV888 DBV (SOT-23, 5), and TLV4888 D (SOIC, 14) and PW (TSSOP, 14) from preview to production data (active)Go
  • Changed human-body-model (HBM) from ±1000V to ±4000V in ESD RatingsGo

Changes from Revision * (December 2024) to Revision A (September 2025)

  • Changed TLV888D (SOIC) and TLV2888 DGK (VSSOP) packages from preview to production data (active)Go
  • Updated application circuit in Description Go
  • Updated offset voltage drift value to fix typo in Description Go
  • Updated TLV2888 (D, SOIC-8) Thermal Information Go
  • Added note 1 to common-mode rejection ratio for TA = –40°C to +125°CGo
  • Updated open-loop voltage gain for RLOAD = 2kΩ test conditionGo
  • Added note 1 to open-loop voltage gain for TA = –40°C to +125°CGo
  • Added note 1 to voltage output swing from rail for no loadGo
  • Updated voltage output swing from rail for no loadGo