SCAS585R November   1996  – May 2026 SN74LVCC3245A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 A Port (VCCA = 2.5V ± 0.2V and VCCB = 3.3V ± 0.3V)
    2. 6.2 B Port (VCCA = 2.5V ± 0.2V and VCCB = 3.3V ± 0.3V)
    3. 6.3 B Port (VCCA = 3.6V and VCCB = 5.5V)
    4. 6.4 A and B Port (VCCA and VCCB = 3.6V)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Glitch-free Power Supply Sequencing
    5. 7.5 VCC Isolation and VCC Disconnect
    6. 7.6 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Power-Up Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LVCC3245AUNIT
DB (SSOP)DBQ (SSOP)PW (TSSOP)
24 PINS24 PINS24 PINS
RθJAJunction-to-ambient thermal resistance90.761100.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.944.844.7°C/W
RθJBJunction-to-board thermal resistance49.734.555.8°C/W
ψJTJunction-to-top characterization parameter18.89.56.8°C/W
ψJBJunction-to-board characterization parameter49.337.255.4°C/W
(1) For more information about traditional and new thermal metrics, see the application note, Semiconductor and IC Package Thermal Metrics.