SCAS847J July   2007  – June 2025 CDCE925 , CDCEL925

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EEPROM Specification
    7. 5.7 Timing Requirements: CLK_IN
    8. 5.8 Timing Requirements: SDA/SCL
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Setting
      2. 7.3.2 Default Device Setting
      3. 7.3.3 SDA/SCL Serial Interface
      4. 7.3.4 Data Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA/SCL Hardware Interface
    5. 7.5 Programming
  9. 8 Register Maps
    1. 8.1 SDA/SCL Configuration Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Spread-Spectrum Clock (SSC)
        2. 9.2.2.2 PLL Frequency Planning
        3. 9.2.2.3 Crystal Oscillator Start-Up
        4. 9.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 9.2.2.5 Unused Inputs and Outputs
        6. 9.2.2.6 Switching Between XO and VCXO Mode
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VDD Device supply voltage 1.7 1.8 1.9 V
VDDOUT Output Yx supply voltage CDCE925 2.3 3.6 V
CDCEL925 1.7 1.9
VIL Low-level input voltage LVCMOS 0.3 × VDD V
VIH High-level input voltage LVCMOS 0.7 × VDD V
VI(thresh) Input voltage threshold LVCMOS 0.5 × VDD V
VI(S) Input voltage S0 0 1.9 V
S1, S2, SDA, SCL; V(Ithresh) = 0.5VDD 0 3.6
VI(CLK) Input voltage, CLK 0 1.9 V
IOH /IOL Output current VDDOUT = 3.3V ±12 mA
VDDOUT = 2.5V ±10
VDDOUT = 1.8V ±8
CL Output load LVCMOS 15 pF
TA Operating free-air temperature –40 85 °C
CRYSTAL AND VCXO(1)
fXtal Crystal input frequency (fundamental mode) 8 27 32 MHz
ESR Effective series resistance 100 Ω
fPR Pulling (0V ≤ VCtrl ≤ 1.8V)(2) ±120 ±150 ppm
VCtrl Frequency control voltage 0 VDD V
C0/C1 Pullability ratio 220
CL On-chip load capacitance at Xin and Xout 0 20 pF
(1) For more information about VCXO configuration, and crystal recommendation, see the VCXO Application Guideline for CDCE(L)9xx Family application note.
(2) Pulling range depends on crystal-type, on-chip crystal load capacitance and PCB stray capacitance; pulling range of minimum ±120ppm applies for crystal listed in the VCXO Application Guideline for CDCE(L)9xx Family application note.