SCAS946B November   2016  – March 2025 CDCLVP111-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 LVECL DC Electrical Characteristics
    6. 5.6 LVPECL DC Electrical Characteristics
    7. 5.7 AC Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Fanout Buffer for Line Card Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 LVPECL Output Termination
          2. 7.2.1.2.2 Input Termination
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power-Supply Filtering
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)CDCLVP111-SPUNIT
HFG (CFP)
36 PINS
RθJAJunction-to-ambient thermal resistance(2)95.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance50.7°C/W
RθJBJunction-to-board thermal resistance80.8°C/W
ψJTJunction-to-top characterization parameter46.1°C/W
ψJBJunction-to-board characterization parameter79.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

34.0

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) According to JESD 51-7 standard.