SCDS145D October   2003  – August 2026 SN74CB3Q3253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: RGY, PW, DBQ, DGV Packages
    6. 5.6 Electrical Characteristics: DYY Package
    7. 5.7 Switching Characteristics: RGY, PW, DBQ, DGV Packages
    8. 5.8 Switching Characteristics: DYY Package
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74CB3Q3253UNIT
DBQ (SSOP)DGV (TVSOP)PW (TSSOP)RGY (VQFN)DYY
(SOT-23-THN)
16 PINS16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance106.4134.2114.372.3126.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance65.166.157.971.914.9
RθJBJunction-to-board thermal resistance62.780.172.247.172.8
ψJTJunction-to-top characterization parameter18.717.716.319.573.0
ψJBJunction-to-board characterization parameter64.679.671.847.271.1
RθJC(bot)Junction-to-case (bottom) thermal resistance———31.4—
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.