SCDS145D October   2003  – August 2026 SN74CB3Q3253

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: RGY, PW, DBQ, DGV Packages
    6. 5.6 Electrical Characteristics: DYY Package
    7. 5.7 Switching Characteristics: RGY, PW, DBQ, DGV Packages
    8. 5.8 Switching Characteristics: DYY Package
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2 Typical Application

The application shown is a 4-bit bus being multiplexed between two devices. The OE and S pins are used to control the chip from the bus controller. This example is a very generic example and can apply to many situations. If an application requires less than 4 bits, be sure to tie the A side to either high or low on unused channels.

SN74CB3Q3253 Typical Application of the SN74CB3Q3253Figure 8-1 Typical Application of the SN74CB3Q3253