SCDS384B September   2018  – August 2025 TMUX6119

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics (Dual Supplies: ±15V)
    6. 5.6 Switching Characteristics (Dual Supplies: ±15V)
    7. 5.7 Electrical Characteristics (Single Supply: 12V)
    8. 5.8 Switching Characteristics (Single Supply: 12V)
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Truth Tables
  8. Detailed Description
    1. 7.1 Overview
      1. 7.1.1  On-Resistance
      2. 7.1.2  Off-Leakage Current
      3. 7.1.3  On-Leakage Current
      4. 7.1.4  Transition Time
      5. 7.1.5  Break-Before-Make Delay
      6. 7.1.6  Enable Turn-On and Enable Turn-Off Time
      7. 7.1.7  Charge Injection
      8. 7.1.8  Off Isolation
      9. 7.1.9  Channel-to-Channel Crosstalk
      10. 7.1.10 Bandwidth
      11. 7.1.11 THD + Noise
      12. 7.1.12 AC Power Supply Rejection Ratio (AC PSRR)
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Ultra-low Leakage Current
      2. 7.3.2 Ultra-low Charge Injection
      3. 7.3.3 Bidirectional and Rail-to-Rail Operation
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Thermal Information

THERMAL METRIC(1)TMUX6119UNIT
DCN (SOT-23)
8 PINS
RθJAJunction-to-ambient thermal resistance180.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance138.8°C/W
RθJBJunction-to-board thermal resistance90.4°C/W
ΨJTJunction-to-top characterization parameter73.7°C/W
ΨJBJunction-to-board characterization parameter90.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.