SCDS423A October 2020 – May 2024 TMUX1575
PRODUCTION DATA
THERMAL METRIC(1) | DEVICE | UNIT | |
---|---|---|---|
YCJ (WCSP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 89.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 21.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 0.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 21.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |