SCDS457B May   2023  – July 2024 TMUX4827

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Source or Drain Continuous Current
    6. 5.6 Source or Drain RMS Current
    7. 5.7 Electrical Characteristics 
    8. 5.8 Switching Characteristics 
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  On-Leakage Current
    3. 6.3  Off-Leakage Current
    4. 6.4  Power-Off Leakage Current
    5. 6.5  Propagation Delay
    6. 6.6  tON (VDD) and tOFF (VDD) Time
    7. 6.7  Transition Time
    8. 6.8  Break-Before-Make
    9. 6.9  THD + Noise
    10. 6.10 Power Supply Rejection Ratio (PSRR)
    11. 6.11 Charge Injection
    12. 6.12 Bandwidth
    13. 6.13 Off Isolation
    14. 6.14 Crosstalk
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
    3. 7.3 Feature Description
      1. 7.3.1 Beyond the Supply
      2. 7.3.2 Bidirectional Operation
      3. 7.3.3 Over Temperature Protection
      4. 7.3.4 Power-Off Protection
      5. 7.3.5 1.8V Logic Compatible Inputs
      6. 7.3.6 Fail-Safe Logic
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Audio Amplifier Switching
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VDD to GND  Supply voltage -0.5 6 V
VSEL to GND Logic control input pin voltage -0.5 6 V
VS or VD to GND Source or drain voltage (Sx, Dx) to ground -13 13 V
VS to VD or VS Source to drain or source (same channel)(4) -15 15 V
Source to drain or source (seperate channel)(3) -24 24 V
ISEL Logic control input pin current -30 30 mA
IS or ID (CONT) Source or drain continuous current (Sx, Dx) IDC + 10 %(5) mA
TA Ambient temperature -55 150 °C
Tstg Storage temperature -65 150 °C
TJ Junction temperature 150 °C
Ptot Total power dissipation(6) 750 mW
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.
(4) Maximum voltage between source and drain pins within the same channel. For example: S1A to D1 or S1A to S1B
(5) Refer to Source or Drain Continuous Current table for IDC specifications.
(6) For WCSP package: Ptot derates linearily above TA = 70°C by 9.4mW/°C.