SCES558E July   2004  – January 2025 SN74LVC2G14-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, –40°C to 85°C
    7. 4.7 Switching Characteristics, –40°C to 125°C
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 CMOS Schmitt-Trigger Inputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application
        1. 7.1.1.1 Design Requirements
          1. 7.1.1.1.1 Power Considerations
          2. 7.1.1.1.2 Input Considerations
          3. 7.1.1.1.3 Output Considerations
        2. 7.1.1.2 Detailed Design Procedure
        3. 7.1.1.3 Application Curve
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) SN74LVC2G14-Q1 UNIT
DBV (SOT23) DCK (SC70)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 165 259 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.