SCES582I July   2004  – February 2025 SN74AVCH2T45

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2V
    7. 5.7  Switching Characteristics: VCCA = 1.5V
    8. 5.8  Switching Characteristics: VCCA = 1.8V
    9. 5.9  Switching Characteristics: VCCA = 2.5V
    10. 5.10 Switching Characteristics: VCCA = 3.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.8V
      2. 5.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5V
      3. 5.12.3 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3V
  7. 6 Parameter Measurement Information
    1. 6.1 23
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Isolation
      2. 7.3.2 2-Rail Design
      3. 7.3.3 IO Ports are 4.6 V Tolerant
      4. 7.3.4 Partial Power Down Mode
      5. 7.3.5 Bus Hold on Data Inputs
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC (1)SN74AVCH2T45UNIT
DCT (SSOP)DCU (VSSOP)YZP (DSBGA)
8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance183.1246.9105.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance101.595.21.6
RθJBJunction-to-board thermal resistance111.0158.410.8
ψJTJunction-to-top characterization parameter27.634.13.1
ψJBJunction-to-board characterization parameter109.2157.510.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.