SCES582I July   2004  – February 2025 SN74AVCH2T45

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configurations and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics: VCCA = 1.2V
    7. 5.7  Switching Characteristics: VCCA = 1.5V
    8. 5.8  Switching Characteristics: VCCA = 1.8V
    9. 5.9  Switching Characteristics: VCCA = 2.5V
    10. 5.10 Switching Characteristics: VCCA = 3.3V
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
      1. 5.12.1 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 1.8V
      2. 5.12.2 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 2.5V
      3. 5.12.3 Typical Propagation Delay (A to B) vs Load Capacitance, TA = 25°C, VCCA = 3.3V
  7. Parameter Measurement Information
    1. 6.1 23
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Isolation
      2. 7.3.2 2-Rail Design
      3. 7.3.3 IO Ports are 4.6 V Tolerant
      4. 7.3.4 Partial Power Down Mode
      5. 7.3.5 Bus Hold on Data Inputs
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unidirectional Logic Level-Shifting Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bidirectional Logic Level-Shifting Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Enable Times
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision H (April 2015) to Revision I (February 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated DCT and DCU Thermal Information Go
  • Added the Receiving Notifications of Documentation Updates, Support Resources, Electrostatic Discharge Caution, and Glossary sectionsGo

Changes from Revision G (April 2015) to Revision H (April 2015)

  • Added additional applications.Go
  • Updated Overview section. Go
  • Updated Layout Guidelines section. Go

Changes from Revision F (November 2007) to Revision G (February 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go