SCES640L January   2007  – January 2026 TXS0102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 1.8 ± 0.15V
    7. 5.7  Switching Characteristics, VCCA = 2.5 ± 0.2V
    8. 5.8  Switching Characteristics, VCCA = 3.3 ± 0.3V
    9. 5.9  Switching Characteristics: Tsk, TMAX
    10. 5.10 Operating Characteristics: VCCA = 1.5V to 3.3V, VCCB = 1.5V to 3.3V
    11. 5.11 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TXS0102 UNIT
DCU DQE DCT DTT YZP DQM
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS
RθJA  Junction-to-ambient thermal resistance 239.8 229.6 168.5 219.8 105.8 212.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance  88.5 89.1 84.6 139.0 1.6 84.2 °C/W
RθJB Junction-to-board thermal resistance  151.6 128.0 96.1 122.3 10.8 118.1 °C/W
YJT Junction-to-top characterization parameter  30.9 2.8 15.1 17.5 3.1 2.8 °C/W
YJB Junction-to-board characterization parameter  150.5 127.7 94.7 122.2 10.8 117.8 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance  N/A N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.