SCES709C September   2008  – May 2025 TXB0106

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQB/RSV/DYY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2V
    8. 5.8  Timing Requirements: VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements: VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements: VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements: VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics: VCCA = 1.2V (BQB/RSV/DYY)
    13. 5.13 Switching Characteristics: VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5V ± 0.1V (BQB/RSV/DYY)
    15. 5.15 Switching Characteristics: VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8V ± 0.15V (BQB/RSV/DYY)
    17. 5.17 Switching Characteristics: VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5V ± 0.2V (BQB/RSV/DYY)
    19. 5.19 Switching Characteristics: VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3V ± 0.3V (BQB/RSV/DYY)
    21. 5.21 Switching Characteristics: VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Power Up
      4. 7.3.4 Output Load Considerations
      5. 7.3.5 Enable and Disable
      6. 7.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1 Layout Guidelines

To confirm reliability of the device, following common printed-circuit board layout guidelines is recommended.

  • Use bypass capacitors on power supplies. Place bypass capacitors as close as possible to the VCCA, VCCB pin, and GND pin.
  • Use short trace-lengths to avoid excessive loading.
  • Keep PCB signal trace-lengths short enough so that the round-trip delay of any reflection is less than the one-shot duration, approximately 10ns, establishing that any reflection encounters low impedance at the source driver.