SCES709C September   2008  – May 2025 TXB0106

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQB/RSV/DYY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2V
    8. 5.8  Timing Requirements: VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements: VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements: VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements: VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics: VCCA = 1.2V (BQB/RSV/DYY)
    13. 5.13 Switching Characteristics: VCCA = 1.2V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5V ± 0.1V (BQB/RSV/DYY)
    15. 5.15 Switching Characteristics: VCCA = 1.5V ± 0.1V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8V ± 0.15V (BQB/RSV/DYY)
    17. 5.17 Switching Characteristics: VCCA = 1.8V ± 0.15V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5V ± 0.2V (BQB/RSV/DYY)
    19. 5.19 Switching Characteristics: VCCA = 2.5V ± 0.2V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3V ± 0.3V (BQB/RSV/DYY)
    21. 5.21 Switching Characteristics: VCCA = 3.3V ± 0.3V (Other Packages)
    22. 5.22 Operating Characteristics
    23. 5.23 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Power Up
      4. 7.3.4 Output Load Considerations
      5. 7.3.5 Enable and Disable
      6. 7.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Output Load Considerations

TI recommends careful PCB layout practices with short PCB trace lengths to avoid excessive capacitive loading and to establish that proper O.S. triggering takes place. Keep PCB signal trace-lengths short enough so that the round trip delay of any reflection is less than the one-shot duration. This improves signal integrity by ensuring that any reflection sees a low impedance at the driver. The O.S. circuits are designed to stay on for approximately 10ns. The maximum capacitance of the lumped load that can be driven also depends directly on the one-shot duration. With very heavy capacitive loads, the one-shot can time-out before the signal is driven fully to the positive rail. The O.S. duration has been set to best optimize trade-offs between dynamic ICC, load driving capability, and maximum bit-rate considerations. Both PCB trace length and connectors add to the capacitance that the TXB0106 output undergoes, so it is recommended that this lumped-load capacitance be considered to avoid O.S. retriggering, bus contention, output signal oscillations, or other adverse system-level affects.