SCES778B September   2008  – March 2024 SN74AVC16T245-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA= 1.2 V
    7. 6.7  Switching Characteristics: VCCA= 1.5 V ± 0.1 V
    8. 6.8  Switching Characteristics: VCCA= 1.8 V ± 0.15 V
    9. 6.9  Switching Characteristics: VCCA= 2.5 V ± 0.2 V
    10. 6.10 Switching Characteristics: VCCA= 3.3 V ± 0.3 V
    11. 6.11 Operating Characteristics
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
      2. 8.3.2 Partial-Power-Down Mode Operation
      3. 8.3.3 VCC Isolation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Enable Times
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) SN74AVC16T245-Q1 UNIT
DGV (TVSOP)
48 PINS
RθJA Junction-to-ambient thermal resistance 77.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.4 °C/W
RθJB Junction-to-board thermal resistance 39.5 °C/W
ψJT Junction-to-top characterization parameter 3.5 °C/W
ψJB Junction-to-board characterization parameter 39 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.