SCES791B August   2009  – August 2025 TXB0106-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
    1.     Pin Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (TXB0106I)
    6. 5.6  Electrical Characteristics (TXB0106)
    7. 5.7  Timing Requirements – VCCA = 1.2V, TA = 25°C
    8. 5.8  Timing Requirements – VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements – VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements – VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements – VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics –VCCA = 1.2V, TA = 25°C
    13. 5.13 Switching Characteristics – VCCA = 1.5V ± 0.1V (TXB0106I)
    14. 5.14 Switching Characteristics – VCCA = 1.5V ± 0.1V (TXB0106)
    15. 5.15 Switching Characteristics – VCCA = 1.8V ± 0.15V (TXB0106I)
    16. 5.16 Switching Characteristics – VCCA = 1.8V ± 0.15V (TXB0106)
    17. 5.17 Switching Characteristics – VCCA = 2.5V ± 0.2V (TXB0106I)
    18. 5.18 Switching Characteristics – VCCA = 2.5V ± 0.2V (TXB0106)
    19. 5.19 Switching Characteristics – VCCA = 3.3V ± 0.3V (TXB0106I)
    20. 5.20 Switching Characteristics – VCCA = 3.3V ± 0.3V (TXB0106)
    21. 5.21 Operating Characteristics
    22. 5.22 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Architecture
      2. 6.3.2 Input Driver Requirements
      3. 6.3.3 Power Up
      4. 6.3.4 Output Load Considerations
      5. 6.3.5 Enable and Disable
      6. 6.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 7Device and Documentation Support
    1. 7.1 Third-Party Products Disclaimer
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC (1)TXB0106-Q1UNIT
PW (TSSOP)BQB (WQFN)
16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance107.563.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance42.364.3°C/W
RθJBJunction-to-board thermal resistance52.633.6°C/W
ψJTJunction-to-top characterization parameter4.22.8°C/W
ψJBJunction-to-board characterization parameter5233.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance-16.2°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application note.