SCES791B August   2009  – August 2025 TXB0106-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
    1.     Pin Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (TXB0106I)
    6. 5.6  Electrical Characteristics (TXB0106)
    7. 5.7  Timing Requirements – VCCA = 1.2V, TA = 25°C
    8. 5.8  Timing Requirements – VCCA = 1.5V ± 0.1V
    9. 5.9  Timing Requirements – VCCA = 1.8V ± 0.15V
    10. 5.10 Timing Requirements – VCCA = 2.5V ± 0.2V
    11. 5.11 Timing Requirements – VCCA = 3.3V ± 0.3V
    12. 5.12 Switching Characteristics –VCCA = 1.2V, TA = 25°C
    13. 5.13 Switching Characteristics – VCCA = 1.5V ± 0.1V (TXB0106I)
    14. 5.14 Switching Characteristics – VCCA = 1.5V ± 0.1V (TXB0106)
    15. 5.15 Switching Characteristics – VCCA = 1.8V ± 0.15V (TXB0106I)
    16. 5.16 Switching Characteristics – VCCA = 1.8V ± 0.15V (TXB0106)
    17. 5.17 Switching Characteristics – VCCA = 2.5V ± 0.2V (TXB0106I)
    18. 5.18 Switching Characteristics – VCCA = 2.5V ± 0.2V (TXB0106)
    19. 5.19 Switching Characteristics – VCCA = 3.3V ± 0.3V (TXB0106I)
    20. 5.20 Switching Characteristics – VCCA = 3.3V ± 0.3V (TXB0106)
    21. 5.21 Operating Characteristics
    22. 5.22 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Architecture
      2. 6.3.2 Input Driver Requirements
      3. 6.3.3 Power Up
      4. 6.3.4 Output Load Considerations
      5. 6.3.5 Enable and Disable
      6. 6.3.6 Pullup or Pulldown Resistors on I/O Lines
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 7Device and Documentation Support
    1. 7.1 Third-Party Products Disclaimer
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  10. 8Revision History
  11. 9Mechanical, Packaging, and Orderable Information

7.4.1 Layout Guidelines

To ensure reliability of the device, the following common printed-circuit board layout guidelines are recommended:

  • Bypass capacitors should be used on power supplies, and should be placed as close as possible to the VCCA and VCCB pins and the GND pin
  • Short trace-lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the O.S. duration, approximately 10ns, ensuring that any reflection encounters low impedance at the source driver.