SCHS149G November   1998  – January 2025 CD54HC147 , CD74HC147 , CD74HCT147

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.2.2 Layout Example

CD54HC147 CD74HC147 CD74HCT147 Example Trace Corners for Improved Signal Integrity Figure 7-1 Example Trace Corners for Improved Signal Integrity
CD54HC147 CD74HC147 CD74HCT147 Example Bypass Capacitor Placement for TSSOP and Similar PackagesFigure 7-2 Example Bypass Capacitor Placement for TSSOP and Similar Packages
CD54HC147 CD74HC147 CD74HCT147 Example Bypass Capacitor Placement for SOT, SC70 and Similar PackagesFigure 7-4 Example Bypass Capacitor Placement for SOT, SC70 and Similar Packages
CD54HC147 CD74HC147 CD74HCT147 Example Bypass Capacitor Placement for WQFN and Similar PackagesFigure 7-3 Example Bypass Capacitor Placement for WQFN and Similar Packages
CD54HC147 CD74HC147 CD74HCT147 Example Damping Resistor Placement for Improved Signal Integrity Figure 7-5 Example Damping Resistor Placement for Improved Signal Integrity