SCLS517B August   2003  – April 2025 SN74ACT00-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Specifications
    1. 3.1 Absolute Maximum Ratings
    2. 3.2 Recommended Operating Conditions
    3. 3.3 Thermal Information
    4. 3.4 Electrical Characteristics
    5. 3.5 Switching Characteristics
    6. 3.6 Operating Characteristics
  5. 4Parameter Measurement Information
  6. 5Detailed Description
    1. 5.1 Functional Block Diagram
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Tape and Reel Information
    2. 8.2 Mechanical Data

3.3 Thermal Information

THERMAL METRIC(1) D (SOIC) PW (TSSOP) BQA (WQFN) UNIT
14 PINS 14 PINS 14 PINS
R θJA Junction-to-ambient thermal resistance 86(2) 145.7 91.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance — 76.5 99.4 °C/W
R θJB Junction-to-board thermal resistance — 102.0 61.0 °C/W
ψ JT Junction-to-top characterization parameter — 18.8 14.5 °C/W
ψ JB Junction-to-board characterization parameter — 100.7 60.8 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance — — 37.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.