SCLS519B July   2003  – January 2025 SN74HC253-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, CL = 50pF
    7. 4.7 Switching Characteristics, CL = 150pF
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VCC Supply voltage 2 5 6 V
VIH High-level input voltage VCC = 2V 1.5 V
VCC = 4.5V 3.15
VCC = 6V 4.2
VIL Low-level input voltage VCC = 2V 0.5 V
VCC = 4.5V 1.35
VCC = 6V 1.8
VI Input voltage 0 VCC V
VO Output voltage 0 VCC V
tt Input rise and fall time VCC = 2V 1000 ns
VCC = 4.5V 500
VCC = 6V 400
TA Operating free-air temperature -40 125 oC
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, implications of Slow or Floating CMOS Inputs,literature number SCBA004