SCPS238A February   2021  – August 2021 TCA9416

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Enable and Disable
      3. 8.3.3 Pull up resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Startup Considerations with Large Capacitive Load Mismatches
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary

6.4 Thermal Information

THERMAL METRIC(1) TCA9416 TCA9416 UNIT
DDF DTM
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 177.6 212.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 98.7 105.3 °C/W
RθJB Junction-to-board thermal resistance 97.8 124.1 °C/W
ψJT Junction-to-top characterization parameter 12.2 4.5 °C/W
ψJB Junction-to-board characterization parameter 97.2 23.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.