SCPS292 July   2025 TCA9539A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Timing Requirements
    7. 5.7 RESET Timing Requirements
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I/O Port
      2. 7.3.2 RESET Input
      3. 7.3.3 Interrupt ( INT) Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
    6. 7.6 Register Map
      1. 7.6.1 Device Address
      2. 7.6.2 Control Register And Command Byte
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Calculating Junction Temperature and Power Dissipation
        2. 8.2.2.2 Minimizing ICC When I/Os Control LEDs
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TCA9539A-Q1 UNIT
PW (TSSOP)
24 PINS
RθJA Junction-to-ambient thermal resistance 108.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54 °C/W
RθJB Junction-to-board thermal resistance 62.8 °C/W
ψJT Junction-to-top characterization parameter 11.1 °C/W
ψJB Junction-to-board characterization parameter 62.3 °C/W
(1) For more information about traditional and new thermal metrics, see the application report, Semiconductor and IC Package Thermal Metrics.