SLAAEI9 December   2023 MSPM0C1104 , MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G3105 , MSPM0G3106 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3506 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0L1105 , MSPM0L1106 , MSPM0L1228

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1MSPM0 Portfolio Overview
    1. 1.1 Introduction
    2. 1.2 Portfolio Comparison of STM8 MCUs to MSPM0 MCUs
  5. 2Ecosystem And Migration
    1. 2.1 Ecosystem Comparison
      1. 2.1.1 MSPM0 Software Development Kit (MSPM0 SDK)
      2. 2.1.2 The IDE Supported By MSPM0
      3. 2.1.3 SysConfig
      4. 2.1.4 Debug Tools
      5. 2.1.5 LaunchPad
    2. 2.2 Migration Process
      1. 2.2.1 Step 1. Choose The Right MSPM0 MCU
      2. 2.2.2 Step 2. Set Up IDE And Quick Introduction of CCS
        1. 2.2.2.1 Set Up IDE
        2. 2.2.2.2 Quick Introduction of CCS
      3. 2.2.3 Step 3. Set Up MSPM0 SDK And Quick Introduction of MSPM0 SDK
        1. 2.2.3.1 Set Up MSPM0 SDK
        2. 2.2.3.2 Quick Introduction of SDK
      4. 2.2.4 Step 4. Software Evaluation
      5. 2.2.5 Step 5. PCB Board Design
      6. 2.2.6 Step 6. Mass Production
    3. 2.3 Example
  6. 3Core Architecture Comparison
    1. 3.1 CPU
    2. 3.2 Embedded Memory Comparison
      1. 3.2.1 Flash and EEPROM Features
      2. 3.2.2 Flash and EEPROM Organization
        1. 3.2.2.1 Flash and EEPROM Regions
        2. 3.2.2.2 NONMAIN Memory of MSPM0
      3. 3.2.3 Embedded SRAM
    3. 3.3 Power UP and Reset Summary and Comparison
    4. 3.4 Clocks Summary and Comparison
      1. 3.4.1 Oscillators
      2. 3.4.2 Clock Signal Comparison
    5. 3.5 MSPM0 Operating Modes Summary and Comparison
      1. 3.5.1 Operating Modes Comparison
      2. 3.5.2 MSPM0 Capabilities in Lower Modes
      3. 3.5.3 Entering Lower-Power Modes
      4. 3.5.4 Low-Power Mode Code Examples
    6. 3.6 Interrupts and Events Comparison
      1. 3.6.1 Interrupts and Exceptions
        1. 3.6.1.1 Interrupt Management of MSPM0
        2. 3.6.1.2 Interrupt Controller (ITC) of STM8
      2. 3.6.2 Event Handler of MSPM0
      3. 3.6.3 Event Management Comparison
    7. 3.7 Debug and Programming Comparison
      1. 3.7.1 Debug Mode Comparison
      2. 3.7.2 Programming Mode Comparison
        1. 3.7.2.1 Bootstrap Loader (BSL) Programming Options
  7. 4Digital Peripheral Comparison
    1. 4.1 General-Purpose I/O (GPIO, IOMUX)
    2. 4.2 Universal Asynchronous Receiver-Transmitter (UART)
    3. 4.3 Serial Peripheral Interface (SPI)
    4. 4.4 Inter-integrated Circuit Interface (I2C)
    5. 4.5 Timers (TIMGx, TIMAx)
    6. 4.6 Windowed Watchdog Timer (WWDT)
  8. 5Analog Peripheral Comparison
    1. 5.1 Analog-to-Digital Converter (ADC)
    2. 5.2 Comparator (COMP)
    3. 5.3 Voltage References (VREF)

2.1.5 LaunchPad

Like STM8, MSPM0 also has corresponding LaunchPad development kits to support rapid development.

LaunchPad kits are easy-to-use EVMs that contain everything needed to start developing on the MSPM0. This includes an onboard debug probe for programming, debugging, and measuring power consumption with EnergyTrace™ technology. MSPM0 LaunchPad kits also feature onboard buttons, LEDs, and temperature sensors among other circuitry. Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and more.

Figure 2-6 illustrates the LaunchPad overview. which contains the MCU and a XDS110 debugger. You can also use other debuggers like J-Link to debug the MCU after removing the jumpers.

GUID-FCA6E03B-B1FB-43BF-A949-E091E1555E06-low.png Figure 2-6 MSPM0G3507 Launchpad Overview

Jumper isolation block contains Power(GND,5V,3.3V), UART(RXD, TXD), reset pin, arm debug channel(SWDIO,SWCLK) and BSL.

In addition to jumper caps, it is possible to burn using the standard Arm Cortex 10 pins connector (as shown in Figure 2-7) which is located on the right side of the Launchpad. The Cortex Debug Connector supports JTAG debug, Serial Wire debug and Serial Wire Viewer (via SWO connection when Serial Wire debug mode is used) operations.

GUID-52FA0E04-2402-4517-AD09-FCB5706B8FDA-low.png Figure 2-7 Arm Cortex 10-Pin Definition

Figure 2-8 shows some feature function of MSPM0G3507 Launchpad.

The lower sides of the Launchpad are the connectors of the booster pack, which are used to plug in specific functional modules directly and quickly build prototypes. In addition to this, it's also possible to use DuPont wire alone to lead out for quick use. The Launchpad has a user-defined button on each side, a temperature sensor, a light sensor, a monochrome LED, and an RGB LED underneath.

GUID-E9D9A5C2-A099-44D9-AAEE-C731694147FE-low.png Figure 2-8 MSPM0G3507 Launchpad Feature Function