SLAAEP2 January 2026 ULC1001
TI uses EPO-TEK 323LP-LH as the hard glue material in the LCS-FL-RNG15. The material properties of glue can be found in Table 6-4 below.
Parameter | Unit | Value |
|---|---|---|
Young's modulus | GPa | 2.67 |
Density | Kg/m3 | 1190 |
Poisson's ratio | 1 | 0.30 |
The glue layer is applied to two interfaces. One is the interface between the lens and the piezo, and the other is between the lens and the thin film. The glue is represented by a Thin Elastic Layer, a model advised by COMSOL for accurately simulating the properties of thin adhesives. A damping loss factor of 0.02 has been incorporated into the simulation. The screenshot of the setting is shown in Figure 6-2.
Figure 6-2 Thin Elastic Layer for Glue