SLAAEP2 January   2026 ULC1001

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Acronyms
  5. 2Introduction
  6. 3Simulation Environment
  7. 4Simulation of Lens
  8. 5Simulation of Piezo Transducer
  9. 6Simulation of Lens Cover System (LCS)
    1. 6.1 Physics and Boundary Conditions
      1. 6.1.1 Glue
      2. 6.1.2 Thin Film
      3. 6.1.3 Housing
    2. 6.2 Results
  10. 7Resources

Glue

TI uses EPO-TEK 323LP-LH as the hard glue material in the LCS-FL-RNG15. The material properties of glue can be found in Table 6-4 below.

Table 6-1 Material Properties of Glue

Parameter

Unit

Value

Young's modulus

GPa

2.67

Density

Kg/m3

1190

Poisson's ratio

1

0.30

The glue layer is applied to two interfaces. One is the interface between the lens and the piezo, and the other is between the lens and the thin film. The glue is represented by a Thin Elastic Layer, a model advised by COMSOL for accurately simulating the properties of thin adhesives. A damping loss factor of 0.02 has been incorporated into the simulation. The screenshot of the setting is shown in Figure 6-2.

 Thin Elastic Layer for GlueFigure 6-2 Thin Elastic Layer for Glue