SLAS986D November   2014  â€“ February 2018 AMC7836

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DAC
    6. 6.6  Electrical Characteristics: ADC and Temperature Sensor
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics: DAC
    10. 6.10 Typical Characteristics: ADC
    11. 6.11 Typical Characteristics: Reference
    12. 6.12 Typical Characteristics: Temperature Sensor
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converters (DACs)
        1. 7.3.1.1 DAC Output Range and Clamp Configuration
          1. 7.3.1.1.1 Auto-Range Detection
        2. 7.3.1.2 DAC Register Structure
        3. 7.3.1.3 DAC Clear Operation
      2. 7.3.2 Analog-to-Digital Converter (ADC)
        1. 7.3.2.1 Analog Inputs
          1. 7.3.2.1.1 Bipolar Analog Inputs
          2. 7.3.2.1.2 Unipolar Analog Inputs
        2. 7.3.2.2 ADC Sequencing
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 Programmable Out-of-Range Alarms
          1. 7.3.2.4.1 Unipolar Inputs Out-of-Range Alarms
          2. 7.3.2.4.2 Unipolar Inputs Out-of-Range Alarms
          3. 7.3.2.4.3 ALARMIN Alarm
          4. 7.3.2.4.4 Hysteresis
          5. 7.3.2.4.5 False-Alarm Protection
      3. 7.3.3 Internal Temperature Sensor
      4. 7.3.4 Internal Reference
      5. 7.3.5 General Purpose I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 All-Positive DAC Range Mode
      2. 7.4.2 All-Negative DAC Range Mode
      3. 7.4.3 Mixed DAC Range Mode
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1  Interface Configuration: Address 0x00 – 0x02
        1. 7.6.1.1 Interface Configuration 0 Register (address = 0x00) [reset = 0x30]
          1. Table 9. Interface Config 0 Register Field Descriptions (R/W)
        2. 7.6.1.2 Interface Configuration 1 Register (address = 0x01) [reset = 0x00]
          1. Table 10. Interface Config 1 Register Field Descriptions
        3. 7.6.1.3 Device Configuration Register (address = 0x02) [reset = 0x03]
          1. Table 11. Device Config Register Field Descriptions
      2. 7.6.2  Device Identification: Address 0x03 – 0x0D
        1. 7.6.2.1 Chip Type Register (address = 0x03) [reset = 0x08]
          1. Table 12. Chip Type Register Field Descriptions
        2. 7.6.2.2 Chip ID Low Byte Register (address = 0x04) [reset = 0x36]
          1. Table 13. Chip ID Low Byte Register Field Descriptions
        3. 7.6.2.3 Chip ID High Byte Register (address = 0x05) [reset = 0x0C]
          1. Table 14. Chip ID High Byte Register Field Descriptions
        4. 7.6.2.4 Version ID Register (address = 0x06) [reset = 0x00]
          1. Table 15. Version ID Register Field Descriptions
        5. 7.6.2.5 Manufacturer ID Low Byte Register (address = 0x0C) [reset = 0x51]
          1. Table 16. Manufacturer ID Low Byte Register Field Descriptions
        6. 7.6.2.6 Manufacturer ID High Byte Register (address = 0x0D) [reset = 0x04]
          1. Table 17. Manufacturer ID High Byte Register Field Descriptions
      3. 7.6.3  Register Update (Buffered Registers): Address 0x0F
        1. 7.6.3.1 Register Update Register (address = 0x0F) [reset = 0x00]
          1. Table 18. Register Update Register Field Descriptions
      4. 7.6.4  General Device Configuration: Address 0x10 through 0x17
        1. 7.6.4.1 ADC Configuration Register (address = 0x10) [reset = 0x00]
          1. Table 19. ADC Configuration Register Field Descriptions
        2. 7.6.4.2 False Alarm Configuration Register (address = 0x11) [reset = 0x70]
          1. Table 21. False Alarm Configuration Register Field Descriptions
        3. 7.6.4.3 GPIO Configuration Register (address = 0x12) [reset = 0x00]
          1. Table 24. GPIO Configuration Register Field Descriptions
        4. 7.6.4.4 ADC MUX Configuration 0 Register (address = 0x13) [reset = 0x00]
          1. Table 25. ADC MUX Configuration 0 Register Field Descriptions
        5. 7.6.4.5 ADC MUX Configuration 1 Register (address = 0x14) [reset = 0x00]
          1. Table 26. ADC MUX Configuration 1 Register Field Descriptions
        6. 7.6.4.6 ADC MUX Configuration 2 Register (address = 0x15) [reset = 0x00]
          1. Table 27. ADC MUX Configuration 2 Register Field Descriptions
        7. 7.6.4.7 DAC Clear Enable 0 Register (address = 0x18) [reset = 0x00]
          1. Table 28. DAC Clear Enable 0 Register Field Descriptions
        8. 7.6.4.8 DAC Clear Enable 1 Register (address = 0x19) [reset = 0x00]
          1. Table 29. DAC Clear Enable 1 Register Field Descriptions
      5. 7.6.5  DAC Clear and ALARMOUT Source Select: Address 0x1A through 0x1D
        1. 7.6.5.1 DAC Clear Source 0 Register (address = 0x1A) [reset = 0x00]
          1. Table 30. DAC Clear Source 0 Register Field Descriptions
        2. 7.6.5.2 DAC Clear Source 1 Register (address = 0x1B) [reset = 0x00]
          1. Table 31. DAC Clear Source 1 Register Field Descriptions
        3. 7.6.5.3 ALARMOUT Source 0 Register (address = 0x1c) [reset = 0x00]
          1. Table 32. ALARMOUT Source 0 Register Field Descriptions
        4. 7.6.5.4 ALARMOUT Source 1 Register (address = 0x1D) [reset = 0x00]
          1. Table 33. ALARMOUT Source 1 Register Field Descriptions
      6. 7.6.6  DAC Range: Address 0x1E
        1. 7.6.6.1 DAC Range Register (address = 0x1E) [reset = 0x00]
          1. Table 34. DAC Range Register Field Descriptions
        2. 7.6.6.2 DAC Range 1 Register (address = 0x1F) [reset = 0x00]
          1. Table 36. DAC Range 1 Register Field Descriptions
      7. 7.6.7  ADC and Temperature Data: Address 0x20 through 0x4B
        1. 7.6.7.1 ADCn-Data (Low Byte) Register (address = 0x20 through 0x49) [reset = 0x00]
          1. Table 37. ADCn-Data (Low Byte) Register Field Descriptions
        2. 7.6.7.2 ADCn-Data (High Byte) Register (address = 0x20 through 0x49) [reset = 0x00]
          1. Table 38. ADCn-Data (High Byte) Register Field Descriptions
        3. 7.6.7.3 Temperature Data (Low Byte) Register (address = 0x4A) [reset = 0x00]
          1. Table 39. Temperature Data (Low Byte) Register Field Descriptions
        4. 7.6.7.4 Temperature Data (High Byte) Register (address = 0x4B) [reset = 0x00]
          1. Table 40. Temperature Data (High Byte) Register Field Descriptions
      8. 7.6.8  DAC Data: Address 0x50 through 0x6F
        1. 7.6.8.1 DACn-Data (Low Byte) Register (address = 0x50 through 0x6F) [reset = 0x00]
          1. Table 41. DACn-Data (Low Byte) Register Field Descriptions
        2. 7.6.8.2 DACn Data (High Byte) Register (address = 0x50 through 0x6F) [reset = 0x00]
          1. Table 42. DACn Data (High Byte) Register Field Descriptions
      9. 7.6.9  Status Registers: Address 0x70 through 0x72
        1. 7.6.9.1 Alarm Status 0 Register (address = 0x70) [reset = 0x00]
          1. Table 43. Alarm Status 0 Register Field Descriptions
        2. 7.6.9.2 Alarm Status 1 Register (address = 0x71) [reset = 0x00]
          1. Table 44. Alarm Status 1 Register Field Descriptions
        3. 7.6.9.3 General Status Register (address = 0x72) [reset = 0x0C]
          1. Table 45. General Status Register Field Descriptions
      10. 7.6.10 GPIO: Address 0x7A
        1. 7.6.10.1 GPIO Register (address = 0x7A) [reset = 0xFF]
          1. Table 46. GPIO Register Field Descriptions
      11. 7.6.11 Out-Of-Range ADC Thresholds: Address 0x80 through 0x93
        1. 7.6.11.1 ADCn-Upper-Thresh (Low Byte) Register (address = 0x80 through 0x93) [reset = 0xFF]
          1. Table 47. ADCn-Upper-Thresh (Low Byte) Register Field Descriptions
        2. 7.6.11.2 ADCn-Upper-Thresh (High Byte) Register (address = 0x80 through 0x93) [reset = 0x0F]
          1. Table 48. ADCn-Upper-Thresh (High Byte) Register Field Descriptions
        3. 7.6.11.3 ADCn-Lower-Thresh (Low Byte) Register (address = 0x80 through 0x93) [reset = 0x00]
          1. Table 49. ADCn-Lower-Thresh (Low Byte) Register Field Descriptions
        4. 7.6.11.4 ADCn-Lower-Thresh (High Byte) Register (address = 0x80 through 0x93) [reset = 0x00]
          1. Table 50. ADCn-Lower-Thresh (High Byte) Register Field Descriptions Field Descriptions
        5. 7.6.11.5 LT-Upper-Thresh (Low Byte) Register (address = 0x94) [reset = 0xFF]
          1. Table 51. LT-Upper-Thresh (Low Byte) Register Field Descriptions
        6. 7.6.11.6 LT-Upper-Thresh (High Byte) Register (address = 0x95) [reset = 0x07]
          1. Table 52. LT-Upper-Thresh (High Byte) Register Field Descriptions
        7. 7.6.11.7 LT-Lower-Thresh (Low Byte) Register (address = 0x96) [reset = 0x00]
          1. Table 53. LT-Lower-Thresh (Low Byte) Register Field Descriptions
        8. 7.6.11.8 LT-Lower-Thresh (High Byte) Register (address = 0x97) [reset = 0x08]
          1. Table 54. LT-Lower-Thresh (High Byte) Register Field Descriptions
      12. 7.6.12 Alarm Hysteresis Configuration: Address 0xA0 and 0xA5
        1. 7.6.12.1 ADCn-Hysteresis Register (address = 0xA0 through 0xA4) [reset = 0x08]
          1. Table 55. ADCn-Hysteresis Register Field Descriptions
        2. 7.6.12.2 LT-Hysteresis Register (address = 0xA5) [reset = 0x08]
          1. Table 56. LT-Hysteresis Register Field Descriptions
      13. 7.6.13 Clear and Power-Down Registers: Address 0xB0 through 0XB4
        1. 7.6.13.1 DAC Clear 0 Register (address = 0xB0) [reset = 0x00]
          1. Table 57. DAC Clear 0 Register Field Descriptions
        2. 7.6.13.2 DAC Clear 1 Register (address = 0xB1) [reset = 0x00]
          1. Table 58. DAC Clear 1 Register Field Descriptions
        3. 7.6.13.3 Power-Down 0 Register (address = 0xB2) [reset = 0x00]
          1. Table 59. Power-Down 0 Register Field Descriptions
        4. 7.6.13.4 Power-Down 1 Register (address = 0xB3) [reset = 0x00]
          1. Table 60. Power-Down 1 Register Field Descriptions
        5. 7.6.13.5 Power-Down 2 Register (address = 0xB4) [reset = 0x00]
          1. Table 61. Power-Down 2 Register Field Descriptions
      14. 7.6.14 ADC Trigger: Address 0xC0
        1. 7.6.14.1 ADC Trigger Register (address = 0xC0) [reset = 0x00]
          1. Table 62. ADC Trigger Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Temperature Sensing Applications
      2. 8.1.2 Current Sensing Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ADC Input Conditioning
        2. 8.2.2.2 DAC Output Range Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Device Reset Options
      1. 9.1.1 Power-on-Reset (POR)
      2. 9.1.2 Hardware Reset
        1. 9.1.2.1 Software Reset
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated