SLASFE0 July   2025 MSPM0H3216-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes (PT, RUK, RGZ, RHB, DGS32, DGS28, RGE, DGS20 Packages)
    3. 6.3 Signal Descriptions
      1.      11
      2.      12
      3.      13
      4.      14
      5.      15
      6.      16
      7.      17
      8.      18
      9.      19
      10.      20
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Supply Current Characteristics
      1. 7.4.1 RUN/SLEEP Modes
      2. 7.4.2 STOP/STANDBY Modes
    5. 7.5  Power Supply Sequencing
      1. 7.5.1 POR and BOR
      2. 7.5.2 Power Supply Ramp
    6. 7.6  Flash Memory Characteristics
    7. 7.7  Timing Characteristics
    8. 7.8  Clock Specifications
      1. 7.8.1 System Oscillator (SYSOSC)
      2. 7.8.2 Low Frequency Oscillator (LFOSC)
      3. 7.8.3 High Frequency Crystal/Clock
      4. 7.8.4 Low Frequency Crystal/Clock
    9. 7.9  Digital IO
      1. 7.9.1  Electrical Characteristics
      2. 7.9.2 Switching Characteristics
    10. 7.10 ADC
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
      3. 7.10.3 Linearity Parameters
      4. 7.10.4 Typical Connection Diagram
    11. 7.11 Temperature Sensor
    12. 7.12 VREF
      1. 7.12.1 Voltage Characteristics
      2. 7.12.2 Electrical Characteristics
    13. 7.13 I2C
      1. 7.13.1 I2C Characteristics
      2. 7.13.2 I2C Filter
      3. 7.13.3 I2C Timing Diagram
    14. 7.14 SPI
      1. 7.14.1 SPI
      2. 7.14.2 SPI Timing Diagram
    15. 7.15 UART
    16. 7.16 TIMx
    17. 7.17 Windowed Watchdog Characteristics
    18. 7.18 Emulation and Debug
      1. 7.18.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  CPU
    3. 8.3  Operating Modes
      1. 8.3.1 Functionality by Operating Mode (MSPM0H321x)
    4. 8.4  Power Management Unit (PMU)
    5. 8.5  Clock Module (CKM)
    6. 8.6  DMA_B
    7. 8.7  Events
    8. 8.8  Memory
      1. 8.8.1 Memory Organization
      2. 8.8.2 Peripheral File Map
      3. 8.8.3 Peripheral Interrupt Vector
    9. 8.9  Flash Memory
    10. 8.10 SRAM
    11. 8.11 GPIO
    12. 8.12 IOMUX
    13. 8.13 ADC
    14. 8.14 Temperature Sensor
    15. 8.15 VREF
    16. 8.16 CRC
    17. 8.17 UART
    18. 8.18 SPI
    19. 8.19 I2C
    20. 8.20 Low-Frequency Sub System (LFSS)
    21. 8.21 RTC_B
    22. 8.22 IWDT_B
    23. 8.23 WWDT
    24. 8.24 Timers (TIMx)
    25. 8.25 Device Analog Connections
    26. 8.26 Input/Output Diagrams
    27. 8.27 Serial Wire Debug Interface
    28. 8.28 Device Factory Constants
    29. 8.29 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
DEVICE NAME (1)(3) FLASH / SRAM (KB) ADC CH. UART / I2C / SPI TIMG TIMA GPIOs PACKAGE
(PACKAGE SIZE)(2)
M0H3216QPTRQ1 64 / 8 27 3 / 2 / 1 4 1 45 48 LQFP
(9mm × 9mm)
M0H3215QPTRQ1 32 / 8
M0H3216QRGZRQ1 64 / 8 27 3 / 2 / 1 4 1 45 48 VQFN
(7mm × 7mm)
M0H3215QRGZRQ1 32 / 8
M0H3216QRHBRQ1 64 / 8 18 3 / 2 / 1 4 1 29 32 VQFN
(5mm × 5mm)
M0H3215QRHBRQ1 32 / 8
M0H3216QDGS32RQ1 64 / 8 18 3 / 2 / 1 4 1 29 32 VSSOP
(8.1mm × 4.9mm)
M0H3215QDGS32RQ1 32 / 8
M0H3216QDGS28RQ1 64 / 8 15 3 / 2 / 1 4 1 25 28 VSSOP
(7.1mm × 4.9mm)
M0H3215QDGS28RQ1 32 / 8
M0H3216QRGERQ1 64 / 8 13 3 / 2 / 1 4 1 21 24 VQFN
(4mm × 4mm)
M0H3215QRGERQ1 32 / 8
M0H3216QDGS20RQ1 64 / 8 12 3 / 2 / 1 4 1 17 20 VSSOP
(5.1mm × 4.9mm)
M0H3215QDGS20RQ1 32 / 8
M0H3216QRUKRQ1 64 / 8 12 3 / 2 / 1 4 1 17 20 WQFN
(3mm × 3mm)
M0H3215QRUKRQ1 32 / 8
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI web site.
(2) The package size (length × width) is a nominal value and includes pins, where applicable. For package dimensions with tolerances, see the Mechanical Data in Section 12.
(3) For more information about the device name, see Section 10.1.