SLASFI0 July   2026 TMUXHS5212

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 High-Speed Performance Parameters
    7. 5.7 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable and Power Savings
      2. 6.3.2 Data Line Biasing
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 USB 3.2/4 Implementation for USB Type-C
    3. 7.3 Systems Examples
      1. 7.3.1 USB4 / TBT 3.0 Demuxing
      2. 7.3.2 DisplayPort Main Link Mux/Demux
      3. 7.3.3 MIPI Camera Serial Interface
    4. 7.4 PCIe Lane Muxing
      1. 7.4.1 Application Curves
    5. 7.5 Power Supply Recommendations
    6. 7.6 Layout
      1. 7.6.1 Layout Guidelines
      2. 7.6.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.6.2 Layout Example

Figure 7-9 shows a basic layout example for USB 3.2/4 Type-C MUX implementation.

TMUXHS5212 TMUXHS5212 Layout ExampleFigure 7-9 TMUXHS5212 Layout Example