SLAU967 November   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Overview
    2. 2.2 Power Requirements
    3. 2.3 XDS110 Debug Probe
    4. 2.4 Measure Current Draw of the MSPM0G5187
    5. 2.5 Clocking
    6. 2.6 BoosterPack Plug-in Module Pinout
  9. 3Software
    1. 3.1 Software Development Options
    2. 3.2 Out-of-Box GUI
    3. 3.3 CCS Cloud
  10. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Trademarks
  12. 6Related Documentation
    1. 6.1 Supplemental Content

1.1 Introduction

The MSPM0G5187 is an Arm®Cortex®-M0+ based 32-bit CPU with dual-bank flash and enhanced security features and a frequency up to 80MHz. The device can be used in a variety of tasks from a small module of personal electronics with the USB 2.0 FS and serial audio interface (SAI), to a full-application utilizing LIN interface, flash ECC, and SRAM ECC to fulfill automotive applications. In addition, the device integrates a neural-network processing unit (NPU) to support edge AI within M0+ platform. The easiest way to get started with the MSPM0G5187 is with the LP-MSPM0G5187 LaunchPad™. The LaunchPad™ has all the features to load code, debug, and prototype right out of the box.

The device features 128kB of dual-bank flash with 32kB of SRAM and 8kB of data flash memory. The device also has internal analog such as a internal 12-bit ADC, two voltage references, a high speed comparator with 8-bit reference DAC. The MSPM0G5187 is the first MSPM0 device that features USB 2.0 FS, SAI, and NPU.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack™ plug-in modules. Users can quickly add features like wireless connectivity, graphical displays, environmental sensing and much more. Design you own BoosterPack™ plug-in module or choose among many already available from TI and third-party developers.

To make prototyping easier, TI provides the MSPM0 software development kit (SDK), which has a variety of code examples to demonstrate how to use the internal peripherals.

Free software development tools are also available, such as TI's Code Composer Studio™ IDE. TI also supports 3rd party IDEs, such as IAR Embedded Workbench® and Arm® Kiel® μVision® IDE. Code Composer Studio IDE supports EnergyTrace™ software technology with the MSPM0G5187 LaunchPad™ development kit. More information about the LaunchPad™ development kit, the supported BoosterPack™ plug-in modules, and the available resources can be found at TI's LaunchPad™ development kit portal. To get started quickly and find available resources in the MSPM0 software development kit (SDK), visit the TI Developer Zone. The MSPM0 MCUs are also supported by extensive online collateral, training with MSPM0 Academy and online support through the TI E2E™ support forums.