SLLSEH3D July   2013  – September 2025 SN65HVD888

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings: JEDEC Specifications
    3. 5.3 ESD Ratings: IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Power Dissipation Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low-Power Standby Mode
      2. 7.3.2 Bus Polarity Correction
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Configuration
      2. 8.1.2 Bus Design
      3. 8.1.3 Cable Length Versus Data Rate
      4. 8.1.4 Stub Length
      5. 8.1.5 3 to 5V Interface
      6. 8.1.6 Noise Immunity
      7. 8.1.7 Transient Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Design and Layout Considerations For Transient Protection
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.4 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VID Differential input voltage –12 12 V
VI Input voltage at any bus terminal (separate or common mode)(1) –7 12 V
VIH High-level input voltage (driver, driver-enable, and receiver-enable inputs) 2 VCC V
VIL Low-level input voltage (driver, driver-enable, and receiver-enable inputs) 0 0.8 V
IO Output current Driver –60 60 mA
Receiver –8 8
CL Differential load capacitance 50 pF
RL Differential load resistance 60 Ω
1/tUI Signaling rate 0.3 250 kbps
TJ Junction temperature –40 150 °C
TA(2) Operating free-air temperature (see Section 5.5 for additional information) –40 125 °C
(1) The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which disables the driver outputs when the junction temperature reaches 170°C.