SLLU395 March 2025
The unboxed EVM contains one blank PCB with unpopulated IC footprints and headers. Also included in the EVM kit are 10 pcs of 1x24 headers (100 mil).
Each PCB has two columns of through-hole connections made for standard 100mil headers. The idea is to place one of the column header pairs face down so that the PCB can connect to a standard breadboard. The other column pair is to be used with headers facing up so that jumper wires, power supply leads, oscilloscope probes, I2C/SPI driver connections, or other equipment can connect easily to the PCB with jumper wires. The break-apart PCBs are also small enough to allow for an additional connections on the standard breadboard in case various load resistors or capacitors are required for testing.
To use the EVM, break away the desired IC package from the main PCB. You can use some type of mechanical tool to break away the package.
The next step is to solder the headers for the desired test setup. When the PCB is soldered and the headers are in place, the PCB can be used with a standard breadboard for additional IO connections.
In this example setup, column 1 is reserved for breadboard connections. Column 2 (outer-most column) can connect directly to the breadboard. Column 3 (inner-most column) has the headers facing up for external connections like jumper wires, o-scope probes, power supplies connections, and so forth.
The final step is to complete all necessary connections for the desired testing setup. In this example, an Arduino Mega is used as the I2C driver. The I2C SDA and SCL lines are level translated from 5 V to 3.3 V using the TCA39306EVM. The DUT on the IO-EXP-ADAPTER-EVM is the TCA9539-Q1 16-bit Automotive Grade I2C IO Expander. Various scope probes are used to monitor the SDA and SCL channels on the IO expander in the test. Power supply connections are made with various hook clip and jumper connections to and from the breadboard.