SLLU395 March   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Evaluation Setup
  9. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Compliance Information
    1. 4.1 Compliance and Certifications
  11. 5Additional Information
    1. 5.1 Trademarks
  12. 6Related Documentation
    1. 6.1 Supplemental Content

1.3 Specification

The IO-EXP-ADAPTER-EVM has 10 unique IC footprints that accommodate several package types for TI's I2C / SPI IO expander portfolio. The EVM can break away into four separate smaller PCBs as cost-optimized, quick applications for testing and debug purposes.

The following figure shows a PCB layout for the PW/DB package type. Pin 1 is always located in the top-left column. Both pins in the yellow box are connected to pin 1 of the IC. The next two pins in the row 2 correspond to pin 2 of the IC and so on. The order of pins goes in counter-clockwise fashion.

IO-EXP-ADAPTER-EVM Pin 1 Location Figure 1-1 Pin 1 Location