SLOS158E June   1996  – July 2025 TLV2231

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Available Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Dissipation Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics: VDD = 3V
    5. 6.5 Operating Characteristics, VDD = 3V
    6. 6.6 Electrical Characteristics, VDD = 5V
    7. 6.7 Operating Characteristics, VDD = 5V
    8. 6.8 Typical Characteristics
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Large Capacitive Loads
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Description

The TLV2231 is a single low-voltage operational amplifier available in the SOT-23 package. The TLV2231 offers 2MHz of bandwidth and 1.6V/μs of slew rate for applications requiring good ac performance. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLV2231 is fully characterized at 3V and 5V and is optimized for low-voltage applications.

The TLV2231, with a high input impedance and low noise, is excellent for small-signal conditioning of high-impedance sources, such as piezoelectric transducers. As a result of the micropower dissipation levels combined with 3V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs). The device also drives 600Ω loads for telecom applications.

With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, and minimizes noise pick-up from long printed circuit board (PCB) traces. TI also takes special care to provide a pinout that is optimized for board layout (see the following figure). Both inputs are separated by ground to prevent coupling or leakage paths. The OUT and IN– pins are on the same end of the board to provide negative feedback. Finally, gain setting resistors and the decoupling capacitor are easily placed around the package.

Package Information
PART NUMBER(1) PACKAGE(2) PACKAGE SIZE(3)
TLV2231 DBV (SOT-23, 5) 2.9mm × 2.8mm
(1) See Section 4.
(2) For all available packages, see Section 10.
(3) The package size (length × width) is a nominal value and includes pins, where applicable.

 

TLV2231 Typical Surface-Mount Layout for a Fixed-Gain Noninverting Amplifier Typical Surface-Mount Layout for a Fixed-Gain Noninverting Amplifier