SLOS628A July 2009 – July 2025 TLE2142-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | D (SOIC) | UNIT | |
|---|---|---|---|
| 8 PINS | |||
| R θJA | Junction-to-ambient thermal resistance | 107.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 45 | °C/W |
| R θJB | Junction-to-board thermal resistance | 54.4 | °C/W |
| ψ JT | Junction-to-top characterization parameter 4.2 | °C/W | |
| ψ JB | Junction-to-board characterization parameter | 53.6 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |