SLOU586 February   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specifications
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
    2. 2.2 Single Tone Measurement Setup
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
      1. 3.2.1 Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation

3.2.1 Stack-Up and Material

The TRF2001PEVM is a 61.278-mil, 4-layer board with material type FR-4 370HR. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. Third layer has routing the power signal traces. The signal trace impedance is targeted at 50Ω. The bottom three layers are ground layers.

TRF2001PEVM TRF2001PEVM Stack-Up (Units in Mils) Figure 3-6 TRF2001PEVM Stack-Up (Units in Mils)