In addition to the OVST, users of the RES60A-Q1 can also choose to perform HIPOT, according to specific project guidelines and mission profile requirements for the application. Often, production HIPOT stresses with durations of 5s or 10s are utilized to test circuit boards or circuit card assemblies at the system or subsystem level. Depending on system architecture, this can result in the HIPOT stress appearing across the RES60A-Q1 divider. In device and platform qualification testing, HIPOT stress durations are greater, typically 60s at a time. The RES60A-Q1 is designed to withstand these HIPOT events without significant parametric shifts, in both qualification (60s) or production contexts.

The RES60A-Q1 has been extensively evaluated and shown to be resilient to HIPOT stresses as described in Absolute Maximum Ratings. The rated values incorporate guardbanding for additional margin. In extended validation testing, each ratio of the RES60A was exposed to HIPOT stresses of 4000Vdc, 3000Vrms, and higher, with a 60s stress duration and each stress repeated three times. Following a cooldown interval of 4 minutes, a device health check was performed after each stress to identify any noticeable ratio or absolute drift. For example, in extended validation testing of the RES60A-Q1 the typical shift in t_D due to 4000Vdc HIPOT for 60s (one to three stresses) was measured to be ±0.02% or less. As all ratios of the RES60A-Q1 include a 12.5MΩ R_HV resistance and achieve different ratios by varying the value of R_LV, the measured shifts for each of the various ratio options are comparable.

For this testing, dedicated coupon boards with excellent thermal dissipation characteristics were utilized. While complex circuit card assemblies with worse thermal dissipation can potentially see more significant shifts due to higher self-heating, reduction of the test duration from 60s (qualification) to 5-10s (production) counters this by reducing the total time above 150°C, likely resulting in offsetting effects. In early system development or evaluation phases, some user systems can experience repeated HIPOT stresses, especially if failing components are removed from the board and replaced. The RES60A-Q1 is able to withstand at least three HIPOT tests, provided a duty cycle ≤ 20% is used so the device can cool down between the stresses. For example, if testing for 60s duration, wait at least 4 minutes after the first HIPOT stress before performing a subsequent stress. Due to this robustness, users are able to utilize and re-utilize the same RES60A-Q1 for multiple stresses in the development phase without needing to replace the part after every stress, encouraging board reuse and saving engineering time.

For more information, including detailed test results and testing in excess of the Absolute Maximum Ratings, refer to the RES60A-Q1 Extended Reliability Testing application note.