SLUSAS0F December   2011  – July 2025 BQ2946

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sense Positive Input for V1
      2. 7.3.2 Output Drive, OUT
      3. 7.3.3 Supply Input, VDD
      4. 7.3.4 Thermal Pad, PWRPAD
    4. 7.4 Device Functional Modes
      1. 7.4.1 NORMAL Mode
      2. 7.4.2 OVERVOLTAGE Mode
      3. 7.4.3 Customer Test Mode
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Application Configuration
      2. 8.1.2 29
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Example
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Supply voltageVDD–VSS–0.330V
Input voltageV1–VSS–0.38V
Output voltageOUT–VSS–0.330V
Continuous total power dissipation, PTOTSee Section 6.4
Functional temperature–65110°C
Lead temperature (soldering, 10s), TSOLDER300°C
Storage temperature, Tstg–65150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.