SLUSCY0C May   2018  – September 2025 BQ27Z561

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Supply Current
    6. 5.6  Internal 1.8V LDO (REG18)
    7. 5.7  I/O (PULS, INT)
    8. 5.8  Chip Enable (CE)
    9. 5.9  Internal Temperature Sensor
    10. 5.10 NTC Thermistor Measurement Support
    11. 5.11 Coulomb Counter (CC)
    12. 5.12 Analog Digital Converter (ADC)
    13. 5.13 Internal Oscillator Specifications
    14. 5.14 Voltage Reference1 (REF1)
    15. 5.15 Voltage Reference2 (REF2)
    16. 5.16 Flash Memory
    17. 5.17 I2C I/O
    18. 5.18 I2C Timing — 100kHz
    19. 5.19 I2C Timing — 400kHz
    20. 5.20 HDQ Timing
    21. 5.21 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  BQ27Z561 Processor
      2. 6.3.2  Battery Parameter Measurements
        1. 6.3.2.1 Coulomb Counter (CC)
        2. 6.3.2.2 CC Digital Filter
        3. 6.3.2.3 ADC Multiplexer
        4. 6.3.2.4 Analog-to-Digital Converter (ADC)
        5. 6.3.2.5 Internal Temperature Sensor
        6. 6.3.2.6 External Temperature Sensor Support
      3. 6.3.3  Power Supply Control
      4. 6.3.4  Bus Communication Interface
      5. 6.3.5  Low Frequency Oscillator
      6. 6.3.6  High Frequency Oscillator
      7. 6.3.7  1.8V Low Dropout Regulator
      8. 6.3.8  Internal Voltage References
      9. 6.3.9  Gas Gauging
      10. 6.3.10 Charge Control Features
      11. 6.3.11 Authentication
    4. 6.4 Device Functional Modes
      1. 6.4.1 Lifetime Logging Features
      2. 6.4.2 Configuration
        1. 6.4.2.1 Coulomb Counting
        2. 6.4.2.2 Cell Voltage Measurements
        3. 6.4.2.3 Auto Calibration
        4. 6.4.2.4 Temperature Measurements
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements (Default)
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Changing Design Parameters
      3. 7.2.3 Calibration Process
      4. 7.2.4 Gauging Data Updates
        1. 7.2.4.1 Application Curve
    3. 7.3 Power Supply Requirements
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, Orderable Information

1 Features

  • Supports high-side and low-side current sense resistors: down to 1mΩ
  • SHA-256 authentication responder for increased battery pack security
  • Two independent ADCs
    • Support for simultaneous current and voltage sampling
    • High-accuracy coulomb counter with input offset error: < 1µV (typical)
  • Low-voltage operation: 2V
  • Supports pack-side gauging
  • Wide-range current applications: 1mA to > 5A
  • Active high or low interrupt pin
  • Reduced power modes (typical battery pack operating range conditions)
    • Typical SLEEP mode: < 11μA
    • Typical DEEP SLEEP mode: < 9μA
    • Typical OFF mode: < 1.9μA
  • Internal and external temperature sense functions
  • 400kHz I2C bus communications interface for high-speed programming and data access
  • HDQ one-wire for communication with host
  • Compact 12-pin DSBGA package (YPH)