SLUSG14 March   2025 TPSM843321

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Fixed Frequency Peak Current Mode
      2. 6.3.2  Mode Selection
      3. 6.3.3  Voltage Reference
      4. 6.3.4  Output Voltage Setting
      5. 6.3.5  Switching Frequency Selection, Synchronization
      6. 6.3.6  Phase Shift
      7. 6.3.7  Enable and Adjusting Undervoltage Lockout
      8. 6.3.8  External Soft Start and Prebiased Soft Start
      9. 6.3.9  Power Good
      10. 6.3.10 Minimum On Time, Minimum Off Time, and Frequency Foldback
      11. 6.3.11 Frequency Spread Spectrum
      12. 6.3.12 Overvoltage Protection
      13. 6.3.13 Overcurrent and Undervoltage Protection
      14. 6.3.14 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes Overview
      2. 6.4.2 Heavy Load Operation
      3. 6.4.3 Pulse Frequency Modulation
      4. 6.4.4 Forced Continuous Conduction Modulation
      5. 6.4.5 Dropout Operation
      6. 6.4.6 Minimum On-Time Operation
      7. 6.4.7 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Output Voltage Resistors Selection
        3. 7.2.2.3 Choosing Switching Frequency
        4. 7.2.2.4 Soft-Start Capacitor Selection
        5. 7.2.2.5 Output Capacitor Selection
        6. 7.2.2.6 Input Capacitor Selection
        7. 7.2.2.7 Feedforward Capacitor CFF Selection
        8. 7.2.2.8 Maximum Ambient Temperature
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.3 Best Design Practices

  • Do not exceed the Absolute Maximum Ratings.
  • Do not exceed the Recommended Operating Conditions.
  • Do not exceed the ESD Ratings.
  • Do not allow the SS pin floating.
  • Do not allow the output voltage to exceed the input voltage, nor go below ground.
  • Do not use the value of RθJA given in the Thermal Information table to design your application. See Section 7.2.2.8.
  • Follow all the guidelines and suggestions found in this data sheet before committing the design to production. TI application engineers are ready to help critique your design and PCB layout to help make your project a success.
  • Use a 100nF capacitor connected directly to the VIN and GND pins of the device. See Section 7.2.2.6 for details.