SLUUD88 April   2025 UCC34141-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 EVM Setup and Operation
      1. 2.1.1 Recommended Test Equipment
      2. 2.1.2 External Connections for Easy Evaluation
      3. 2.1.3 Powering the EVM
    2. 2.2 Test Points
    3. 2.3 Oscilloscope Probe Points
  8. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 Assembly and Printed Circuit Board (PCB) Layout
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

3.2 Assembly and Printed Circuit Board (PCB) Layout

The UCC34141EVM-116 is designed using a four-layer, FR4, PCB, fabricated with 2-ounce copper on all four layers. The EVM, PCB demonstrates the important use of ground planes and tented stitching vias for shielding and improving EMI performance. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology can be applied as best as possible.


UCC34141EVM-116 Fully Assembled 3D Top View

Figure 3-2 Fully Assembled 3D Top View

UCC34141EVM-116 Fully Assembled 3D Bottom View

Figure 3-3 Fully Assembled 3D Bottom View

UCC34141EVM-116 PCB Top Layer, Assembly

Figure 3-4 PCB Top Layer, Assembly

UCC34141EVM-116 Ground Layer 2

Figure 3-5 Ground Layer 2

UCC34141EVM-116 Ground Layer 3

Figure 3-6 Ground Layer 3

UCC34141EVM-116 PCB Bottom Layer, Assembly (mirrored view)

Figure 3-7 PCB Bottom Layer, Assembly (mirrored view)