SLVAF95 april   2023 TPS7H5001-SP

 

  1.   Abstract
  2.   Trademarks
  3.   Description
  4.   Features
  5.   Applications
  6. 1System Overview
    1. 1.1 Block Diagram
    2. 1.2 Design Considerations
    3. 1.3 System Design Theory
      1. 1.3.1 Switching Frequency
      2. 1.3.2 Transformer
      3. 1.3.3 RCD and Diode Clamp
      4. 1.3.4 Output Diode and MOSFET
      5. 1.3.5 Output Filter and Capacitance
      6. 1.3.6 Compensation
      7. 1.3.7 Controller Passives
  7. 2Test Results
    1. 2.1 Testing and Results
      1. 2.1.1 Test Setup
      2. 2.1.2 Test Results
        1. 2.1.2.1 Efficiency
        2. 2.1.2.2 Frequency Response
        3. 2.1.2.3 Thermal Characteristics
        4. 2.1.2.4 Output Voltage Ripple
        5. 2.1.2.5 Load Step
        6. 2.1.2.6 Start-Up
        7. 2.1.2.7 Shutdown
        8. 2.1.2.8 Component Stresses
  8. 3Design Files
    1. 3.1 Schematics
    2. 3.2 Bill of Materials
    3. 3.3 Assembly Drawings
  9. 4Related Documentation

2.1.2.3 Thermal Characteristics

Thermal measurement was done with 28 Vin after 20 minutes of running with full load on the output. The hot spot on top side is GaNFET and the transformer. The hot spot on the bottom side is the resistors for the RCD clamp.

GUID-20230405-SS0I-T0FQ-P0KQ-BMRDWNHG5H9Q-low.pngFigure 2-3 Top Board Thermal Characteristics for 28 VIN
GUID-20230405-SS0I-68R1-1SV3-ZDZZXRJRH3DC-low.pngFigure 2-4 Bottom Board Thermal Characteristics for 28 VIN