SLVK305 October 2026 LMX2624-SP
- 1
- Abstract
- Trademarks
- 1 Introduction
- 2 Device and Test Board Information
- 3 Irradiation Facility and Setup
- 4 LETEFF and Range Calculation
- 5 Test Setup and Procedures
- 6 Destructive Single-Event Effects (DSEE)
- 7 Single-Event Transients (SET)
- 8 Single Event Upsets Signature
- 9 Single Event Functional Interrupt (SEFI)
- Summary
- 10References
2 Device and Test Board Information
The LMX2624-SP is packaged in a 64-pin HTQFP-PAP Plastic package as shown in Figure 2-1. The LMX2624-SP evaluation module was used to evaluate the SEL performance and robustness of the LMX2624-SP under heavy ion radiation. A radiation specific board was design and fabricated to characterize the SET performance of LMX2624-SP under heavy ion radiation. The LMX2624EVM is shown in Figure 2-2. The schematic is shown in Figure 2-3. The LMX2624 Rad Board is shown in Figure 2-4. The schematic is shown in Figure 2-5
![Photograph of Delidded LMX2624-SP [Left] and
Pinout Diagram [Right]](/ods/images/SLVK305/GUID-20260318-SS0I-GNS1-WJFH-2SJZ25VL96NB-low.png "Photograph of Delidded LMX2624-SP [Left] and
Pinout Diagram [Right]")
Figure 2-1 Photograph of Delidded LMX2624-SP [Left] and
Pinout Diagram [Right]Note: The package was decapped to reveal the die face for all heavy-ion testing.
Figure 2-2 LMX2624EVM Top View
Figure 2-3 LMX2624EVM Schematics
Figure 2-4 LMX2624 Rad Board Top View
Figure 2-5 LMX2624 Rad Board Schematics