SLVSBF0D July   2012  – July 2026 TPS53015

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Drivers
      2. 6.3.2 5-Volt Regulator
      3. 6.3.3 Soft Start and Prebiased Soft-Start Time
      4. 6.3.4 Overcurrent Protection
      5. 6.3.5 Overvoltage and Undervoltage Protection
      6. 6.3.6 UVLO Protection
      7. 6.3.7 Thermal Shutdown
      8. 6.3.8 Power Good
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Operation
      2. 6.4.2 Auto-skip Eco-Mode Control
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Determine the Inductance Value
        2. 7.2.2.2 Output Capacitor
        3. 7.2.2.3 Input Capacitor
        4. 7.2.2.4 Bootstrap Capacitor
        5. 7.2.2.5 VREG5 Capacitor
        6. 7.2.2.6 Choose Output Voltage Resistors
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TPS53015UNIT
DGS (VSSOP)
10 PINS
RθJAJunction-to-ambient thermal resistance109.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance31.2°C/W
RθJBJunction-to-board thermal resistance54.7°C/W
ψJTJunction-to-top characterization parameter0.9°C/W
ψJBJunction-to-board characterization parameter54.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.