SLVSDR9F October   2016  – June 2026 DRV8702-Q1 , DRV8703-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SPI Timing Requirements
    7. 5.7 Switching Characteristics
    8.     15
    9. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Bridge Control
        1. 6.3.1.1 Logic Tables
      2. 6.3.2  MODE Pin
      3. 6.3.3  nFAULT Pin
      4. 6.3.4  Current Regulation
      5. 6.3.5  Amplifier Output (SO)
        1. 6.3.5.1 SO Sample and Hold Operation
      6. 6.3.6  PWM Motor Gate Drivers
        1. 6.3.6.1 Miller Charge (QGD)
      7. 6.3.7  IDRIVE Pin (DRV8702-Q1 Only)
      8. 6.3.8  Dead Time
      9. 6.3.9  Propagation Delay
      10. 6.3.10 Overcurrent VDS Monitor
      11. 6.3.11 VDS Pin (DRV8702-Q1 Only)
      12. 6.3.12 Charge Pump
      13. 6.3.13 Gate Drive Clamp
      14. 6.3.14 Protection Circuits
        1. 6.3.14.1 VM Undervoltage Lockout (UVLO2)
        2. 6.3.14.2 Logic Undervoltage (UVLO1)
        3. 6.3.14.3 VCP Undervoltage Lockout (CPUV)
        4. 6.3.14.4 Overcurrent Protection (OCP)
        5. 6.3.14.5 Gate Driver Fault (GDF)
        6. 6.3.14.6 Thermal Shutdown (TSD)
        7. 6.3.14.7 Watchdog Fault (WDFLT, DRV8703-Q1 Only)
        8. 6.3.14.8 Reverse Supply Protection
      15. 6.3.15 Hardware Interface
        1. 6.3.15.1 IDRIVE (6-level input)
        2. 6.3.15.2 VDS (6-Level Input)
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 SPI Communication
        1. 6.5.1.1 Serial Peripheral Interface (SPI)
        2. 6.5.1.2 SPI Format
  8. 7 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External FET Selection
        2. 8.2.2.2 IDRIVE Configuration
        3. 8.2.2.3 VDS Configuration
        4. 8.2.2.4 Current Chopping Configuration
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance Sizing
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.2.2.4 Current Chopping Configuration

The chopping current is set based on the sense resistor value and the analog voltage at the VREF pin. Use Equation 11 to calculate the current (I(CHOP)). The amplifier gain, AV, is 19.8 V/V for the DRV8702-Q1 and VIO is typically 5mV (input referred).

Equation 11. DRV8702-Q1 DRV8703-Q1

For example, if the desired chopping current is 15A, select a value of 10mΩ for R(SENSE). The value of VVREF must therefore be 2.975V. Add a resistor divider from the AVDD (5V) pin to set the VVREF at approximately 2.975V. Select a value of 13kΩ for R2 and 19.1kΩ for R1 (the VREF resistor).

If current chopping is not required, the sense resistor can be removed and the source of the low side FET can be connected to ground.

SN and SP must be connected to the source of the low side FET and VREF must be connected to AVDD