SLVSH18C December   2024  – October 2026 TPS4HC120-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Characteristics, SNS
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Low Power Mode
        1. 7.3.2.1 Entry into LPM
        2. 7.3.2.2 During LPM
        3. 7.3.2.3 Exiting LPM
      3. 7.3.3 Accurate Current Sense
      4. 7.3.4 Adjustable Current Limit
      5. 7.3.5 Inductive-Load Switching-Off Clamp
      6. 7.3.6 Fault Detection and Reporting
        1. 7.3.6.1 Diagnostic Enable Function
        2. 7.3.6.2 Multiplexing of Current Sense
        3. 7.3.6.3 FLT Reporting
        4. 7.3.6.4 Fault Table
      7. 7.3.7 Full Diagnostics
        1. 7.3.7.1 Short-to-GND and Overload Detection
        2. 7.3.7.2 Open-Load Detection
          1. 7.3.7.2.1 Channel On
          2. 7.3.7.2.2 Channel Off
        3. 7.3.7.3 Short-to-Battery Detection
        4. 7.3.7.4 Reverse-Polarity and Battery Protection
        5. 7.3.7.5 Thermal Fault Detection
          1. 7.3.7.5.1 Thermal Protection Behavior
      8. 7.3.8 Full Protections
        1. 7.3.8.1 UVLO Protection
        2. 7.3.8.2 Loss of GND Protection
        3. 7.3.8.3 Loss of Power Supply Protection
        4. 7.3.8.4 Reverse Polarity Protection
        5. 7.3.8.5 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 SLEEP
        2. 7.4.1.2 DIAGNOSTIC
        3. 7.4.1.3 ACTIVE
        4. 7.4.1.4 STANDBY DELAY
        5. 7.4.1.5 LOW POWER MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 EMC Transient Disturbances Test
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Without a GND Network
        2. 8.4.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DGQ Package, 28-Pin HVVSOP (Top View)
Table 5-1 Pin Functions See Applications Section for full list of recommended components
PINTYPEDESCRIPTION
NO.NAME
1, 14, 19, 24NCN/ANo internal connection.
2EN1InputInput control for channel 1 activation, internal pulldown.
3EN2InputInput control for channel 2 activation, internal pulldown.
4EN3InputInput control for channel 3 activation, internal pulldown.
5EN4InputInput control for channel 4 activation, internal pulldown.
6SEL1InputSNS channel-selection high bit; internal pulldown.
7SEL0InputSNS channel-selection low bit; internal pulldown.
8DIAG_ENInputEnable-disable pin for diagnostics, internal pulldown.
9FLTOutputOpen drain global fault output. Referred to as FAULT, FLT, or fault pin. Recommended 5kΩ–10kΩ pullup resistor.
10LPMOutputOpen drain LPM status pin. Pulled high by external supply if the device is in LPM or SLEEP state. Pulled low internally when device is in ACTIVE mode. Recommended 5kΩ–10kΩ pullup resistor.
11SNSOutputSNS current output.
12ILIMOutputAdjustable current limit. Connect a resistor to chip GND, SHORT the pin to chip GND, or leave the pin OPEN to set the current limit value.
13GNDPowerGround of device. Connect to resistor- diode ground network to have reverse battery protection.
15, 16VOUT4PowerOutput of channel 4 of the high side switch, connected to load.
17, 18VOUT3PowerOutput of channel 3 of the high side switch, connected to load.
20, 21, 22, 23VBBPowerPower supply
25, 26VOUT2PowerOutput of channel 2 of the high side switch, connected to load.
27, 28VOUT1PowerOutput of channel 1 of the high side switch, connected to load.
Thermal PadPadPowerThermal Pad, internally shorted to ground.