SLVSJH0 May   2026 TPS25752A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
      1. 5.1.1 TPS25752A - Absolute Maximum Ratings
      2. 5.1.2 TPS25752A - Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  TPS25752A - Recommended Operating Conditions
    4. 5.4  Recommended Capacitance
    5. 5.5  Thermal Information
    6. 5.6  Power Supply Characteristics
    7. 5.7  Power Consumption
    8. 5.8  PP_5V Power Switch Characteristics
    9. 5.9  PP_EXT Characteristics - TPS25752A
    10. 5.10 Power Path Supervisory
    11. 5.11 CC Cable Detection Parameters
    12. 5.12 CC VCONN Parameters
    13. 5.13 CC PHY Parameters
    14. 5.14 Thermal Shutdown Characteristics
    15. 5.15 ADC Characteristics
    16. 5.16 Input/Output (I/O) Characteristics
    17. 5.17 BC1.2 Characteristics
    18. 5.18 I2C Requirements and Characteristics
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  USB-PD Physical Layer
        1. 7.3.1.1 USB-PD Encoding and Signaling
        2. 7.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 7.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 7.3.1.4 USB-PD BMC Transmitter
        5. 7.3.1.5 USB-PD BMC Receiver
        6. 7.3.1.6 Squelch Receiver
      2. 7.3.2  Power Management
        1. 7.3.2.1 Power-On And Supervisory Functions
      3. 7.3.3  Power Paths
        1. 7.3.3.1 Internal Sourcing Power Paths
          1. 7.3.3.1.1 PP_5V Current Clamping
          2. 7.3.3.1.2 PP_5V Local Overtemperature Shut Down (OTSD)
          3. 7.3.3.1.3 PP_5V OVP
          4. 7.3.3.1.4 PP_5V UVLO
          5. 7.3.3.1.5 PP_5V Reverse Current Protection
          6. 7.3.3.1.6 PP_CABLE Current Clamp
          7. 7.3.3.1.7 PP_CABLE Local Overtemperature Shut Down (OTSD)
          8. 7.3.3.1.8 PP_CABLE UVLO
        2. 7.3.3.2 External Powerpath Control PP_EXT
          1. 7.3.3.2.1 Overvoltage Protection (OVP)
          2. 7.3.3.2.2 VBUS UVLO
          3. 7.3.3.2.3 Discharging VBUS to Safe Voltage
      4. 7.3.4  Cable Plug and Orientation Detection
        1. 7.3.4.1 Configured as a Source
      5. 7.3.5  Overvoltage Protection (CC1, CC2)
      6. 7.3.6  Default Behavior Configuration (ADCIN1, ADCIN2)
      7. 7.3.7  ADC
      8. 7.3.8  Liquid Detection
      9. 7.3.9  BC 1.2 (USB_P, USB_N)
      10. 7.3.10 Digital Interfaces
        1. 7.3.10.1 General GPIO
        2. 7.3.10.2 I2C Interface
          1. 7.3.10.2.1 I2C Interface Description
            1. 7.3.10.2.1.1 I2C Clock Stretching
            2. 7.3.10.2.1.2 I2C Address Setting
            3. 7.3.10.2.1.3 Unique Address Interface
            4. 7.3.10.2.1.4 Pin Strapping to Configure Default Behavior
      11. 7.3.11 Digital Core
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power States
      2. 7.4.2 Schottky for Current Surge Protection
      3. 7.4.3 Thermal Shutdown
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Liquid Detection Design Requirements
        2. 8.2.1.2 BC1.2 Application Design Requirements
        3. 8.2.1.3 USB Data Support Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Liquid Detection
        2. 8.2.2.2 BC1.2 Application
        3. 8.2.2.3 USB Data Support
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Liquid Detection Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 3.3V Power
        1. 8.3.1.1 VIN_3V3 Input Switch
      2. 8.3.2 1.5V Power
      3. 8.3.3 Recommended Supply Load Capacitance
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Recommended Via Size
        2. 8.4.1.2 Minimum Trace Widths
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Schematic
        2. 8.4.2.2 PCB Plots
          1. 8.4.2.2.1 Component Placement
          2. 8.4.2.2.2 PP5V
          3. 8.4.2.2.3 PP_EXT
          4. 8.4.2.2.4 VBUS
          5. 8.4.2.2.5 I/O
          6. 8.4.2.2.6 PPEXT Gate Driver
          7. 8.4.2.2.7 GND
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
8.4.2.2.7 GND
The GND pad is used to dissipate heat for the TPS25752A device. Connect the GND pins (11, 12, 14 and 31) to the Ground pad (39) underneath the TPS25752A device. Connect the through hole vias from the ground pad on the top layer to a copper pour on the bottom layer to help dissipate heat. Additional vias can be added to improve thermal dissipation.