SLVSJS0 December   2025 TMP4719-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Initialization and Default Temperature Conversion
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 ALERT and T_CRIT Output
      4. 7.3.4 1.2V Logic Compatible Inputs
      5. 7.3.5 Digital Filter
      6. 7.3.6 One-Shot Conversions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Interrupt and Comparator Mode
        1. 7.4.1.1 Interrupt Mode
        2. 7.4.1.2 Comparator Mode
        3. 7.4.1.3 T_CRIT Output
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 Continuous Conversion Mode
    5. 7.5 Programming
      1. 7.5.1 Temperature Data Format
      2. 7.5.2 I2C and SMBus Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
      5. 7.5.5 SMBus Alert Mode
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMP4719-Q1 UNIT
DGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 155.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.9 °C/W
RθJB Junction-to-board thermal resistance 91.7 °C/W
ψJT Junction-to-top characterization parameter 5.6 °C/W
ψJB Junction-to-board characterization parameter 90.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.